ABSTRACT
Light-emitting
diodes (LED) have become the 4th generation light source since the turn of the
century. In the past decade, people witnessed more and more applications of
general lighting applications using LEDs. There is no doubt that solid-state
lighting has become commodity in the comercial markets. Many people are
wondering about what next waves of LED R&D should be focused on. Based on
the speaker’s observation, there are three emerging areas worth noting, namely,
UV-LED, visible light communications (VLC), and micro-LED display. All of these
are for non-lighitng applications. This presentation will briefly touch on
these emerging areas and then focus on UV-LED. The intention is to bring the
on-going technology trend to the awareness of active researchers on LED so that
they can put their resources and efforts on the hot spot. In addition to the
fundamentals of UV-LED and relevant concerns in packaging, certain applications
will be introduced to demonstrate the features of UV-LED which are different from
conventional general lighting.
BIOGRAPHY
Ricky Lee received his
PhD degree from Purdue University in 1992. He joined the Hong Kong University
of Science & Technology (HKUST) in 1993. During his career of tenure-track
faculty at HKUST, Dr Lee once was on secondment to serve as Chief Technology
Officer of Nano & Advanced Materials Institute (NAMI) for two and a half
years. Currently Dr Lee is Chair Professor of Mechanical & Aerospace
Engineering and Director of Center for Advanced Microsystems Packaging (CAMP)
at HKUST. He also has a concurrent appointment as General Director of HKUST
Shenzhen Research Institute and Director of HKUST LED-FPD Technology R&D
Center at Foshan, Guangdong, China. Due to his technical contributions, Dr Lee
received many honors and awards over the years. In addition to being the
recipient of 12 best/outstanding paper awards and 5 major professional society
awards, Dr Lee is Life Fellow of ASME and IMAPS, and Fellow of IEEE and
Institute of Physics (UK). He is also a Distinguished Lecturer and the Senior
Past-President of the IEEE Components, Packaging, and Manufacturing Technology
(CPMT) Society.